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 Home > Publication > Journals (552+13) > 1982 ~ 2004 (91) > 2000. Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints

2000. Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints
Kilwon Cho, Eun Chul Cho, Journal of Adhesion Science and Technology, 2000, 14, 1333-1353
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