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 Home > Publication > Journals > 1982 ~ 2004 (88) > 2002. Synthesis of polyimides containing triazole to improve their adhesion to copper substrate

2002. Synthesis of polyimides containing triazole to improve their adhesion to copper substrate

J.Seo, J.Kang, K.Cho, C.E.Park, Journal of Adhesion Science and Technology, 2002, 16, 1839-1851

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