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2002. Synthesis of polyimides containing triazole to improve their adhesion to copper substrate |
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J.Seo, J.Kang, K.Cho, C.E.Park, Journal of Adhesion Science and Technology, 2002, 16, 1839-1851
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이용약관
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개인정보취급방침
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청소년보호정책
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책임의한계와법적고지
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검색결과수집거부
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