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2001. Effect of the physical and mechanical properties of epoxy resins on the adhesion behavior of epoxy/copper leadframe joints |
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K.Cho, E.C.Cho, C.E.Park, Journal of Adhesion Science and Technology, 2001, 15,439-456
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이용약관
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개인정보취급방침
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청소년보호정책
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책임의한계와법적고지
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검색결과수집거부
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