HOME  /  SEARCH  /  LOG IN  /  SIGN UP
Cover Gallery (48)
Journals (552+11)
2025 (11)
2024 (21)
2023 (34)
2022 (24)
2021 (21)
2020 (38)
2019 (29)
2018 (33)
2017 (28)
2016 (27)
2015 (28)
2014 (21)
2013 (17)
2012 (18)
2011 (19)
2010 (17)
2009 (17)
2008 (19)
2007 (12)
2006 (20)
2005 (21)
1982 ~ 2004 (91)
Patents
Domestic
International
Books & Reviews (14)
 
 Home > Publication > Journals (552+11) > 1982 ~ 2004 (91) > 1994. Adhesion and Welding in the System SAN/PMMA

1994. Effect of the Imidization Temperature of Poly(imide-siloxane) on the Adhesion Strength of Epoxy Resin/Poly(imide-siloxane) Joints
 Yun, H.K., Cho, K., An, J.H., Park, C.E., Sim, S.M., Park, J.M., Journal of Adhesion Science and Technology, 1994, 8, 1395-1411
¸ñ·Ïº¸±â 

À̵¿:  


ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§ | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÀÇÇѰè¿Í¹ýÀû°íÁö | °Ë»ö°á°ú¼öÁý°ÅºÎ
Department of Chemical Engineering, POSTECH, 67, Cheongam-ro, Pohang, 37673, KOREA Tel : 054-279-2932 Fax : 054-279-8298
Copyright © 2008 CRG All rights reserved / Manager : jglee5814@postech.ac.kr  / Supported by ONTOIN