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(2019-09) Toward near-bulk resistivity of Cu for next-generation nano-interconnects: Graphene-coated Cu |
Hyo Chan Lee†, Mankyu Jo†, Hyungsub Lim, Min Seok Yoo, Eunho Lee, Nguyen Ngan Nguyen, Sang Youn Han, Kilwon Cho Carbon 2019
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검색결과수집거부
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Department of Chemical Engineering, POSTECH, 67, Cheongam-ro, Pohang, 37673, KOREA Tel : 054-279-2932 Fax : 054-279-8298
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